HCPL-4100 Datasheet, PDF (4/12 Pages) Agilent(Hewlett-Packard) – Optically Coupled 20 mA Optically Coupled 20 mA

Regulatory Information
The HCPL-4100 has been
approved by the following
organizations:
UL
Recognized under UL 1577,
Component Recognition
Program, File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File CA
88324.
Insulation and Safety Related Specifications
Parameter
Symbol Value Units
Conditions
Min. External Air Gap
(External Clearance)
L(IO1) 7.1 mm Measured from input terminals to output
terminals, shortest distance through air
Min. External Tracking Path
(External Creepage)
L(IO2) 7.4 mm Measured from input terminals to output
terminals, shortest distance path along body
Min. Internal Plastic Gap
(Internal Clearance)
0.08 mm Through insulation distance, conductor to
conductor, usually the direct distance
between the photoemitter and photodetector
inside the optocoupler cavity
Tracking Resistance
CTI
(Comparative Tracking Index)
200 Volts DIN IEC 112/VDE 0303 PART 1
Isolation Group
IIIa
Material Group (DIN VDE 0110, 1/89, Table 1)
Option 300 – surface mount classification is Class A in accordance with CECC 00802.
Absolute Maximum Ratings
(No Derating Required up to 55°C)
Storage Temperature .................................................. -55°C to +125°C
Operating Temperature ................................................. -40°C to +85°C
Lead Solder Temperature .... 260°C for 10 s (1.6 mm below seating plane)
Supply Voltage – V_CC .............................................................. 0 V to 20 V
Average Output Current - I_O ........................................ -30 mA to 30 mA
Peak Output Current - I_O ........................................... Internally Limited
Output Voltage – V_O ........................................................ -0.4 V to 27 V
Input Voltage – V_I ............................................................ -0.5 V to 20 V
Input Power Dissipation – P_I ................................................. 265 mW^[1]
Output Power Dissipation – P_O ............................................. 125 mW^[2]
Total Power Dissipation – P .................................................. 360 mW^[3]
Infrared and Vapor Phase Reflow Temperature
(Option #300) .......................................... see Fig. 1, Thermal Profile
1-364