HDSP-A2XC Datasheet, PDF (3/4 Pages) Agilent(Hewlett-Packard) – Alphanumeric Display, 0.54" (13.7 mm) 2 Character As AlInGaP Red

Absolute Maximum Ratings at T_A = 25˚C
Parameter
DC Forward Current per Segment or DP^[1,2,3]
Peak Forward Current per Segment or DP^[2,3]
Average Forward Current^[3]
Reverse Voltage per Segment or DP (I_R = 100 µA)
Operating Temperature
Storage Temperature
Lead Soldering Conditions
Symbol
I_F
I_PEAK
I_AVE
V_R
T_O
T_S
Temperature
Time
HDSP-A22C/HDSP-A27C
50
100
30
5
–40 to +105
–40 to +120
260
3
Units
mA
mA
mA
V
˚C
˚C
˚C
s
Notes:
1. Derate linearly as shown in Figure 1.
2. For long term performance with minimal light output degradation, drive currents between 10 mA and 30 mA are recommended. For more
information on recommended drive conditions, please refer to Application Brief I-024 (5966-3087E).
3. Operating at currents below 1 mA is not recommended. Please contact your local representative for further information.
Optical/Electrical Characteristics at T_A = 25˚C
Device
Series
HDSP-
Parameter
Symbol Min. Typ.
A22C
A27C
Forward Voltage
Reverse Voltage
Peak Wavelength
I_V
1.70
1.90
V_R
5
20
λ_PEAK
635
Dominant Wavelength^[3]
Spectral Halfwidth
λ_d
∆λ_1/2
622.5 626
17
Speed of Response
τ_s
20
Capacitance
C
40
Max.
2.20
Units
V
V
nm
630
nm
nm
ns
pF
Test Conditions
I_F = 20 mA
I_F = 100 µA
Peak Wavelength
of Spectral Distri-
bution at I_F = 20 mA
Wavelength Width
at Spectral Distri-
bution 1/2 Power
Point at I_F = 20 mA
Exponential Time
Constant, e^-tτs
V_F = 0, f = 1 MHz
Intensity Bin Limits^[1]
(mcd at 10 mA)
Bin Name Min.^[2]
T
18.0
U
25.0
Max.^[2]
25.0
36.0
Notes:
1. Bin categories are established for
classification of products. Products may
not be available in all bin categories.
2. Tolerance for each bin limit is ± 10%.
3