HCPL7520 Datasheet, PDF (3/15 Pages) Agilent(Hewlett-Packard) – Isolated Linear Sensing IC

HCPL-7520 Gull Wing Surface Mount Option 300 Outline Drawing
1.19
(0.047)
MAX.
9.80 ± 0.25
(0.386 ± 0.010)
PAD LOCATION (FOR REFERENCE ONLY)
1.016 (0.040)
1.194 (0.047)
8
7
6
5
A 7520
YYWW
6.350 ± 0.25
(0.250 ± 0.010)
1
2
3
4
(40..812960)TYP.
9.398 (0.370)
9.960 (0.390)
1.194 (0.047)
1.778 (0.070)
0.381 (0.015)
0.635 (0.025)
1.780
(0.070)
MAX.
(04..11695)MAX.
9.65 ± 0.25
(0.380 ± 0.010)
7.62 ± 0.25
(0.300 ± 0.010)
0.20 (0.008)
0.33 (0.013)
1.080 ± 0.320
(0.043 ± 0.013)
2.54
(0.100)
BSC
0.635 ± 0.130
(0.025 ± 0.005)
0.635 ± 0.25
(0.025 ± 0.010)
12° NOM.
DIMENSIONS IN MILLIMETERS (INCHES).
TOLERANCES (UNLESS OTHERWISE SPECIFIED): xx.xx = 0.01
xx.xxx = 0.005
LEAD COPLANARITY
MAXIMUM: 0.102 (0.004)
Solder Reflow Temperature Profile
300
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC. _PEAK
TEMP.
245°C
200
160°C
150°C
140°C
100
2.5°C ± 0.5°C/SEC.
3°C + 1°C/–0.5°C
PREHEATING TIME
150°C, 90 + 30 SEC.
30
SEC.
30
SEC.
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
SOLDERING
TIME
200°C
50 SEC.
ROOM
TEMPERATURE
0
0
TIGHT
TYPICAL
LOOSE
50
100
150
200
250
TIME (SECONDS)
3