HCPL-4200 Datasheet, PDF (3/12 Pages) Agilent(Hewlett-Packard) – Optically Coupled 20 mA Current Loop Receiver

Thermal Profile (Option #300)
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
∆T = 115°C, 0.3°C/SEC
∆T = 100°C, 1.5°C/SEC
1
23
4
5
6
7
8
TIME – MINUTES
∆T = 145°C, 1°C/SEC
9 10 11 12
Figure 1. Maximum Solder Reflow Thermal Profile.
(Note: Use of non-chlorine activated fluxes is recommended.)
Regulatory Information
The HCPL-4200 has been
approved by the following
organizations:
UL
Recognized under UL 1577,
Component Recognition
Program, File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File CA
88324.
Insulation and Safety Related Specifications
Parameter
Symbol Value Units
Conditions
Min. External Air Gap
(External Clearance)
L(IO1) 7.1 mm Measured from input terminals to output
terminals, shortest distance through air
Min. External Tracking Path
(External Creepage)
L(IO2) 7.4 mm Measured from input terminals to output
terminals, shortest distance path along body
Min. Internal Plastic Gap
(Internal Clearance)
Tracking Resistance
CTI
(Comparative Tracking Index)
0.08 mm Through insulation distance, conductor to
conductor, usually the direct distance
between the photoemitter and photodetector
inside the optocoupler cavity
200 volts DIN IEC 112/VDE 0303 PART 1
Isolation Group
IIIa
Material Group (DIN VDE 0110, 1/89, Table 1)
Option 300 – surface mount classification is Class A in accordance with CECC 00802.
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