HCPL-0560 Datasheet, PDF (3/16 Pages) Agilent(Hewlett-Packard) – Dual Channel Bi-directional High Speed Optoisolators

3
Package Outline Drawings
Surface Mount Small-Outline SOIC-8 Package
8
3.937 ± 0.127
(0.155 ± 0.005)
PIN ONE ¹
0.406 ± 0.076
(0.016 ± 0.003)
765
XXX
YWW
234
5.994 ± 0.203
(0.236 ± 0.008)
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
1.270 _BSG
(0.050)
* 5.080 ± 0.127
(0.200 ± 0.005)
7°
45°
X
0.432
(0.017)
3.175 ± 0.127
(0.125 ± 0.005)
1.524
(0.060)
0 ~ 7°
0.228 ± 0.025
(0.009 ± 0.001)
* ^{TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)}
5.207 ± 0.254 (0.205 ± 0.010)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
0.203 ± 0.102
(0.008 ± 0.004)
0.305 _MIN.
(0.012)
Solder Reflow Temperature Profile
260
240
220
200
∆T = 115°C, 0.3°C/SEC
180
160
140
120
100
80
∆T = 100°C, 1.5°C/SEC
60
40
20
0
0
1
23
4
5
6
7
8
TIME – MINUTES
∆T = 145°C, 1°C/SEC
9 10 11 12
(NOTE: USE OF NON-CHLORINE ACTIVATED FLUXES IS HIGHLY RECOMMENDED.)