IAM-91563 Datasheet, PDF (13/16 Pages) Agilent(Hewlett-Packard) – 0.8-6 GHz 3V Downconverter

SOT-363 PCB Footprint
A recommended PCB pad layout
for the miniature SOT-363 (SC-70)
package used by the IAM-91563 is
shown in Figure 35 (dimensions
are in inches). This layout pro-
vides ample allowance for pack-
age placement by automated
assembly equipment without
adding parasitics that could
impair the high frequency RF
performance of the IAM-91563.
The layout is shown with a
nominal SOT-363 package foot-
print superimposed on the PCB
pads.
0.026
SMT Assembly
Reliable assembly of surface
mount components is a complex
process that involves many
material, process, and equipment
factors, including: method of
heating (e.g., IR or vapor phase
reflow, wave soldering, etc.)
circuit board material, conductor
thickness and pattern, type of
solder alloy, and the thermal
conductivity and thermal mass of
components. Components with a
low mass, such as the SOT-363
package, will reach solder reflow
temperatures faster than those
with a greater mass.
The IAM-91563 is has been
qualified to the time-temperature
profile shown in Figure 36. This
0.075
profile is representative of an IR
0.035
reflow type of surface mount
assembly process.
0.016
Figure 35. PCB Pad Layout
(dimensions in inches).
After ramping up from room
temperature, the circuit board
with components attached to it
(held in place with solder paste)
passes through one or more
preheat zones. The preheat zones
increase the temperature of the
board and components to prevent
thermal shock and begin evaporat-
ing solvents from the solder paste.
The reflow zone briefly elevates
the temperature sufficiently to
produce a reflow of the solder.
The rates of change of tempera-
ture for the ramp-up and cool-
down zones are chosen to be low
enough to not cause deformation
of the board or damage to compo-
nents due to thermal shock. The
maximum temperature in the
reflow zone (TMAX) should not
exceed 235 °C.
These parameters are typical for a
surface mount assembly process
for the IAM-91563. As a general
guideline, the circuit board and
components should be exposed
only to the minimum tempera-
tures and times necessary to
achieve a uniform reflow of
solder.
250
T_MAX
200
150
Reflow
Zone
100
Preheat
Zone
Cool Down
Zone
50
0
0
60
120
180
TIME (seconds)
Figure 36. Surface Mount Assembly Profile.
240
300
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