HSMX-S660 Datasheet, PDF (1/11 Pages) Agilent(Hewlett-Packard) – High Performance Surface Mount Chip LEDs

High Performance Surface Mount
Chip LEDs
Technical Data
SunPower Series
HSMx-S660 Series
HSMx-S670 Series
HSMx-S690 Series
Features
• High Brightness AlInGaP
Material
• Industry Standard 2.00 x
1.25 mm Package
• Industry Standard 1.6 x 0.8
mm (Low Profile) Package
• Right Angle Package
• Three Colors Available
• Diffused Optics
• Compatible with IR Solder
Process
• Available in 8 mm Tape on
7” (178 mm) Diameter Reels
Applications
• Keypad Backlighting
• LCD Backlighting
• Symbol Backlighting
• Front Panel Indicator
Description
These chip-type LEDs utilize
aluminum indium gallium
phosphide (AlInGaP) material
technology. The AlInGaP material
has a very high luminous
efficiency, capable of producing
high light output over a wide
range of drive currents. The 590
nm amber, 605 nm orange, and
626 nm red colors are available
in three compact, low profile
packages.
The HSMx-S670 is the industry
standard 2.0 x 1.25 mm package,
and is an excellent all around
package. The HSMx-S690 is the
industry standard 1.6 x 0.8 mm
package. Its low 0.7 mm profile
and wide viewing angle make this
LED excellent for backlighting
applications. The HSMx-S660
right angle, 3.0 x 2.0 x 1.0 mm
LED is optimum for side lighting
applications where direct back-
lighting is not practical.
All packages are compatible with
IR and convective reflow solder-
ing processes.
Device Selection Guide
Footprint
(mm) ^[1][2]
Amber
590 nm
1.6 x 0.8 x 0.7
HSMA-S690
2.0 x 1.25 x 0.8
HSMA-S670
3.0 x 2.0 x 1.0
HSMA-S660
Notes:
1. Dimensions in mm.
2. Tolerance ± 0.1 mm unless otherwise noted.
Orange
605 nm
HSMD-S690
HSMD-S670
HSMD-S660
Red
626 nm
HSMC-S690
HSMC-S670
HSMC-S660