HSMX-H670 Datasheet, PDF (1/8 Pages) Agilent(Hewlett-Packard) – Surface Mount Flip Chip LEDs

H
Surface Mount Flip Chip LEDs
Technical Data
HSMX-H670 Series
HSMX-H690 Series
Features
• Improved Reliability
Through Elimination of
Internal Wire Bond
• -40 to 85°C Operating
Temperature Range
• Small Size
• Industry Standard Footprint
• Diffused Optics
• Compatible with IR
Solder Process
• Four Colors Available
• Available in 8 mm Tape on 7"
(178 mm) Diameter Reels
Applications
• Keypad Backlighting
• LCD Backlighting
• Symbol Backlighting
• Front Panel Indicator
Description
The HSMX-H670 and HSMX-H690
introduce a revolutionary concept
to the world of LEDs. The internal
flip chip construction eliminates
the wire bond between the chip
and printed circuit board.
Consequently as a result of the
robust construction, product
reliability is greatly improved.
The HSMX-H670 and HSMX-H690
are available in four colors. The
HSMX-H670 adheres to the
industry standard 2.0 x 1.25 mm
footprint and is intended for
designs where space is limited.
The small size, low 1.1 mm profile
and wide viewing angle make these
LEDs excellent for backlighting
applications and front panel
illumination. The HSMX-H690
adheres to the 1.6 x 0.8 mm
industry standard footprint. The
low 0.6 mm profile make this
excellent for designs where
space is limited.
Both packages are compatible
with IR and convective reflow
soldering processes.
Device Selection Guide
Footprint
(mm)^[1][2]
1.6 x 0.8 x 0.6
High
Efficiency
Red
HSMS-H690
2.0 x 1.25 x 1.1
HSMS-H670
Notes:
1. Dimensions in mm.
2. Tolerance ± 0.1 mm unless otherwise noted.
Orange
HSMD-H690
HSMD-H670
Yellow
HSMY-H690
HSMY-H670
Green
HSMG-H690
HSMG-H670