HSMP-386X Datasheet, PDF (1/9 Pages) Agilent(Hewlett-Packard) – Surface Mount PIN Diodes

Surface Mount PIN Diodes
Technical Data
HSMP-386x Series
Features
• Unique Configurations in
Surface Mount Packages
– Add Flexibility
– Save Board Space
– Reduce Cost
• Switching
– Low Distortion Switching
– Low Capacitance
• Attenuating
– Low Current Attenuating for
Less Power Consumption
• Matched Diodes for
Consistent Performance
• Better Thermal
Conductivity for Higher
Power Dissipation
• Low Failure in Time (FIT)
Rate^[1]
• Lead-free Option Available
Note:
1. For more information see the
Surface Mount PIN Reliability Data
Sheet.
Pin Connections and
Package Marking, SOT-363
1
6
2
5
3
4
Notes:
1. Package marking provides
orientation, identification, and
date code.
2. See “Electrical Specifications” for
appropriate package marking.
Description/Applications
The HSMP-386x series of general
purpose PIN diodes are designed
for two classes of applications.
The first is attenuators where
current consumption is the most
important design consideration.
The second application for this
series of diodes is in switches
where low capacitance is the
driving issue for the designer.
The HSMP-386x series Total
Capacitance (C_T) and Total
Resistance (R_T) are typical specifi-
cations. For applications that
require guaranteed performance,
the general purpose HSMP-383x
series is recommended.
A SPICE model is not available
for PIN diodes as SPICE does not
provide for a key PIN diode
characteristic, carrier lifetime.