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HSDL-2100 Datasheet, PDF (1/16 Pages) Agilent(Hewlett-Packard) – Infrared IrDA Compliant Transceiver | |||
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Infrared IrDA®
Compliant Transceiver
Technical Data
HSDL-2100
Features
⢠Small Module Package
â height of 5.5 mm max.
⢠Integrated EMI Shield
â excellent Noise Immunity
⢠Lower ILEDA Current
⢠IEC825-Class 1 Eye Safe
⢠Enhanced Reliability
Performance
⢠Fully Compliant to IrDA 1.1
Specifications
â excellent Nose-to-Nose
operation
â 2 Channels:
â 2.4 Kb/s to 115.2 Kb/s
â 576 Kb/s to 4.0 Mb/s
⢠Designed to Accommodate
Light Loss with Cosmetic
Windows
⢠Compatible with ASK,
HP-SIR and TV Remote
⢠No Mode Programming
Required
⢠Interfaces to Various Super
I/O and Controller Devices
Applications
⢠Data Communication:
Notebook Computers,
Subnotebook Computers,
Desktop Computers,
Printers, PDAs, Fax/
Photocopier
⢠Digital Imaging:
Digital Cameras, Photo
Imaging Printers
⢠Digital Appliances:
Internet Web TVs,
Internet Appliances
⢠Industrials and Medical
Instrumentation
â General Data Collection
Devices
â Patient and Pharmaceutical
Data Collection
⢠IR LANs
Description
The HSDL-2100 is a new
generation low-cost Infrared (IR)
transceiver module that provides
the interface between logic and
IR signals for through-air, serial,
half-duplex IR data links and is
compliant to IrDA Physical Layer
Specification 1.1. This module
is also IEC825-Class 1 Eye Safe.
Package
This IR module provides two
output signals, RXD-A for signal
rates from 2.4 Kb/s to 115.2 Kb/s
and RXD-B for signal rates of
0.576 Mb/s to 4.0 Mb/s.
HSDL-2100 consists of the
following basic elements: an
Optical SubAssembly (OSA) and
an Electrical SubAssembly (ESA)
combination with an integrated
EMI shield.
I/O pins configuration table is
shown on page 2. HSDL-2100
block diagram and recommended
application circuit is illustrated in
Figure 1 on page 3. The IR
transceiver module package
outline and recommended
PCBoard Pad layout, (Option
#001 â Integrated EMI shield
with guide pins) is illustrated
in Figure 2 on page 4.
Benefits
This combination of an integrated
EMI shield and transceiver sub-
assembly utilizes existing in-
house high-volume assembly
processes ensuring high quality
and high-volume supply. An
integrated EMI shield helps to
ensure low EMI emissions and
high immunity to EMI fields,
enhancing reliable performance.
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