HMPP-389X Datasheet, PDF (1/11 Pages) Agilent(Hewlett-Packard) – MiniPak Surface Mount RF PIN Switch Diodes

Agilent HMPP-389x Series
MiniPak Surface Mount
RF PIN Switch Diodes
Data Sheet
Description/Applications
These ultra-miniature products
represent the blending of Agilent
Technologies’ proven semiconduc-
tor and the latest in leadless
packaging technology.
The HMPP-389x series is optimized
for switching applications where
low resistance at low current and
low capacitance are required. The
MiniPak package offers reduced
parasitics when compared to
conventional leaded diodes, and
lower thermal resistance.
Low junction capacitance of the
PIN diode chip, combined with
ultra low package parasitics, mean
that these products may be used
at frequencies which are higher
than the upper limit for conven-
tional PIN diodes.
Note that Agilent’s manufacturing
techniques assure that dice
packaged in pairs are taken from
adjacent sites on the wafer,
assuring the highest degree of
match.
The HMPP-389T low inductance
wide band shunt switch is well
suited for applications up to 6 GHz.
Features
• Surface mount MiniPak package
– low height, 0.7 mm (0.028") max.
– small footprint, 1.75 mm²
(0.0028 inch²)
• Better thermal conductivity for
higher power dissipation
• Single and dual versions
• Matched diodes for consistent
performance
• Low capacitance
• Low resistance at low current
• Low FIT (Failure in Time) rate*
• Six-sigma quality level
* For more information, see the Surface
Mount Schottky Reliability Data Sheet.
Pin Connections and
Package Marking
3
4
AA
2
1
Package Lead Code Identification
(Top View)
Single
Anti-parallel
Parallel
Shunt Switch
Product code Date code
Cathode Anode
Notes:
3
43
43
43
4 _{1. Package marking provides orientation and}
identification.
2
#0
12
#2
12
#5
12
1 ^{2. See “Electrical Specifications” for}
Anode _T Cathode
appropriate package marking.