AMMP-5618 Datasheet, PDF (1/9 Pages) Agilent(Hewlett-Packard) – 6-20 GHz General Purpose Amplifier

Agilent AMMP-5618
6–20 GHz General Purpose Amplifier
Data Sheet
Description
Agilent’s AMMP-5618 is a high
power, medium gain amplifier
that operates from 6 GHz to
20 GHz. The amplifier is designed
to be an easy-to-use component
for any surface mount PCB
application. In communication
systems, it can be used as a LO
buffer, or as a transmit driver
amplifier. During typical opera-
tion with a single 5V supply, each
gain stage is biased for Class-A
operation for optimal power
output with minimal distortion.
The amplifier has integrated 50Ω
I/O match, DC blocking, self-bias
and choke to eliminate complex
tuning and assembly processes
typically required by hybrid
(discrete-FET) amplifiers. The
package is fully SMT compatible
with backside grounding and I/O
to simplify assembly.
Note: These devices are ESD
sensitive. The following precau-
tions are strongly recommended.
Ensure that an ESD approved
carrier is used when dice are
transported from one destination
to another. Personal grounding is
to be worn at all times when
handling these devices.
Features
• 5 x 5 mm surface mount package
• Broad band performance 6–20 GHz
• High +19 dBm output power
• Medium 13 dB typical gain
• 50Ω input and output match
Vd
123
• Single 5V (107 mA) supply bias
RFin 8
4 RFout
Applications
• Microwave radio systems
• Satellite VSAT, DBS up/down link
765
Attention:
Observe precautions for
handling electrostatic
sensitive devices.
• LMDS & Pt-Pt mmW long haul
• Broadband wireless access
(including 802.16 and 802.20
WiMax)
• WLL and MMDS loops
• Commercial grade military
ESD Machine Model (Class A)
ESD Human Body Model (Class 0)
Refer to Agilent Application Note A004R:
Electrostatic Discharge Damage and Control.
Absolute Maximum Ratings^[1]
Symbol Parameters/Conditions
Units
Min.
Max.
V_d
Positive Drain Voltage
V
7
I_d
Drain Current
mA
150
P_in
CW Input Power
dBm
20
T_ch
Operating Channel Temperature
°C
+150
T_stg
Storage Case Temperature
°C
-65
+150
T_max
Max. Assembly Temp (60 sec max)
°C
+300
Note:
1. Operation in excess of any one of these conditions may result in permanent damage to this device.