BZT52C Datasheet, PDF (1/3 Pages) Continental Device India Limited – SURFACE MOUNT SILICON ZENER DIODES

ZENER DIODES
FEATURES
Planar Die Construction
350mW Power Dissipation on Ceramic PCB
eneral Purpose, Medium Current
Ideally Suited for Automated Assembly Processes
Available in Lead Free Version
Plastic-Encapsulate Diodes
BZT52C series
-
+
SOD-123
Maximum Ratings (TA=25 unless otherwise noted)
Characteristic
Symbol
Forward Voltage (Note 2) @ IF = 10mA
VF
Power Dissipation(Note 1)
PD
Thermal Resistance, Junction to Ambient Air
RθJ
Operating and Storage Temperature Range
Tj,ATST
Notes: 1. Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm witGh pad areas 25mm²
self-heating effect 3. f=1KHZ
Value
Unit
0.9
V
350
mW
357
/W
-65~ +150
2. Short duration test pulse used to minimize
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