HMC6042 Datasheet, PDF (4/7 Pages) Honeywell Solid State Electronics Center – 2-Axis Magnetic Sensor Circuit

HMC6042
PACKAGE OUTLINES
PACKAGE DRAWING HMC6042 (20-PIN LPCC, dimensions in millimeters)
Dimensions
D
D1
E
E1
A
Minimum
0.89
e = 0.5 Basic
Nominal
5.00 BSC
2.50 BSC
3.60 BSC
1.50 BSC
1.06
Maximum
1.23
MOUNTING CONSIDERATIONS
The following is the recommend printed circuit board (PCB) footprint for the HMC6042.
PCB Pad Definition
The HMC6042 is a fine pitch LCC package with a 0.50mm pin pitch (spacing), with the pin pads defined as 0.50mm by
0.20mm in size. PCB pads are recommended to be oversized by 0.025mm from each pad for a short dimension oversize
of 0.05mm. The interior PCB pad is recommended to be 0.05mm oversized per pin with an exterior oversize of 0.20mm
for proper package centering and to permit test probing. Lead finish is SnAgCu.
Stencil Design and Solder Paste
A 4 mil stencil and 100% paste coverage is recommended for the electrical contact pads. The HMC6042 has been tested
successfully with no-clean solder paste.
Pick and Place
Placement is machine dependant and no restrictions are recommended, and have been tested with mechanical centering.
Placement force should be equivalent 1206 SMT resistors and enough force should be used to squeeze the paste out
from the package/contact pad overlap and to keep the package pin contacts vertical.
Reflow and Rework
No special profile is required for the HMC6042 and compatible with lead eutectic and lead-free solder paste reflow
profiles. Honeywell recommends the adherence to solder paste manufacturer’s guidelines. The HMC6042 may be
reworked with soldering irons, but extreme care must be taken not to overheat the copper pads from the part’s fiberglass
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