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NBPLANN030PGUNV Datasheet, PDF (2/8 Pages) Honeywell Accelerometers – Basic Board Mount Pressure Sensors: NBP Series– Uncompensated/Unamplified
FEATURES AND BENEFITS
Small Size: Package size (as small as 7 mm x 7 mm
[0.276 in x 0.276 in]) is very small when compared to most
board mount pressure sensors, occupying less space on
the PCB and typically allowing for easy placement on
crowded PCBs or in small devices
Durable: Many features allow for use in tough
environments, including:
– Wide operating temperature range from -40 °C to
125 °C [-40 °F to 257 °F]
– Media compatibility options:
o Non-gel coating: The input port is limited to non-
corrosive, non-ionic media such as dry air and
gases and should not be exposed to
condensation; the gases are limited to media that
are compatible with high temperature polyamide,
silicone, alumina ceramic, silicon, gold, and glass
o Gel coating: Uses the same materials in the
wetted media path but is protected from
condensation by a silicone-based gel coating;
allows use in applications where condensation can
occur
– ISO 9001 compliance
Flexible: Numerous package styles, pressure ranges,
housings, gel coating, and porting options simplify
integration into the device manufacturer’s application
Robust: Reflow mounting J-STD-020D, MSL 1 and rapid
stabilization after reflow soldering allow calibration
immediately after mounting
POTENTIAL APPLICATIONS
Medical:
Industrial:
Hospital beds
HVAC Transmitters
Oxygen concentrators
Air movement control
Wound therapy
Environmental control
Blood pressure
Level indicators
monitoring
Leak detection
Industrial controls
Pneumatic controls
Other commercial
applications
Table 1. Absolute Maximum Ratings1
Parameter
Supply voltage (Vsupply)
ESD susceptibility (human body model)
Storage temperature
Soldering time and temperature:
lead solder temperature ( DIP)
peak reflow temperature (Leadless SMT, SMT)
Min.
-12.0
2
-40 [-40]
Max.
12.0
125 [257]
4 s max. at 250 °C [482 °F]
15 s max. at 250 °C [482 °F]
Unit
Vdc
kV
C [ F]
Table 2. Operating Specifications
Parameter
Supply voltage (Vsupply)2
Supply current (at 5.0 Vdc supply)
Specified temperature range4
Accuracy5
Input resistance
Thermal effect on resistance (TCR)7
Min.
1.8
-40 [-40]
2.4
1200
Typ.
5.03
1.5
3.0
Max.
12.0
2.5
125 [257]
0.25
5.5
3200
Unit
Vdc
mA
C [ F]
%FSS BFSL6
kOhm
ppm/ C
Table 3. Environmental Specifications
Parameter
Humidity:
all external surfaces
internal surfaces of gel coating option
internal surfaces of non-gel coating option
Vibration
Shock
Life8
ESD
Solder reflow
Characteristic
0 %RH to 95 %RH, non-condensing
0 %RH to 100 %RH, condensing
0 %RH to 95 %RH, non-condensing
MIL-STD-202F, Method 214A, Condition 1E (15 g, 10 Hz to 2 kHz)
MIL-STD-202F, Method 213B, Condition F (100g, 6 ms duration)
1 million pressure cycles min.
MIL-STD-883 Method 3015.7, Class 2, 2kV, human body model
J-STD-020D, MSL 1, unlimited storage life
2
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