LCC Datasheet, PDF (2/2 Pages) Amkor Technology – Leadless Chip Carrier Package

LCC Series-Large Size Multilayer Ceramic Chip Capacitors
 Dimensions
BW B
T
W
L
TYPE
1515
2520
3530
3640
4540
5550
6560
7565
 Capacitance Range
Size
1515
2520
3530
3640
4540
5550
6560
7565
Dielectric
50V
100V 200V
NPO
473
393
363
X7R
225
105
474
NPO
823
683
563
X7R
475
225
474
NPO
154
134
104
X7R
106
475
225
NPO
224
184
124
X7R
126
565
225
NPO
284
244
184
X7R
156
685
225
NPO
364
304
224
X7R
186
825
275
NPO
654
484
404
X7R
226
186
106
NPO
844
674
504
X7R
336
226
186
L
3.80±0.50
[.15±.020]
6.35±0.50
[.25±.020]
8.90±0.50
[.35±.020]
9.20±0.50
[.36±.020]
11.5±0.50
[.45±.020]
14.0±0.50
[.55±.020]
16.5±0.50
[.65±.020]
19.0±0.50
[.750±.020]
W
3.80±0.50
[.15 ±.020]
5.00±0.50
[.20±.020]
7.60±0.50
[.30±.020]
10.2±0.50
[.40±.020]
10.2±0.50
[.40±.020]
12.7±0.50
[.50±.020]
15.3±0.50
[.60±.020]
16.5±0.50
[.65±.020]
T (max)
3.20
[.126]
3.20
[.126]
5.00
[.200]
5.00
[.200]
5.00
[.200]
5.00
[.200]
5.00
[.200]
5.00
[.200]
Unit : mm [inches]
B (min) BW (min)
1.60
[.059]
4.00
[.157]
5.50
[.217]
6.00
[.236]
7.50
[.295]
9.00
[.354]
11.50
[.453]
0.30
[.012]
0.30
[.012]
0.30
[.012]
0.30
[.012]
0.30
[.012]
0.30
[.012]
0.30
[.012]
14.00
[.551]
0.30
[.012]
Capacitance maximum
500V 1KV
2KV
3KV
4KV
5KV
8KV
103
222
821
124
473
682
473
103
392
222
102
471
224
473
153
472
222
102
823
253
103
472
332
102
471
824
224
473
183
822
472
102
104
373
153
562
362
122
561
105
274
683
273
153
103
182
154
483
203
962
472
152
621
125
394
104
393
223
153
392
184
683
273
153
562
182
681
225
474
124
823
333
223
562
304
104
423
223
682
332
821
335
105
224
104
563
333
103
474
134
553
283
103
472
102
475
125
364
154
823
473
153
 All values are capacitance EIA codes.
 Other dimensions, capacitance values and voltage ratings are available. Please contact HEC.
*Soldering and handling precautions:
Large ceramic capacitors are more prone to thermal and mechanical cracks. To minimize mechanical cracks, capacitors have to be
handled carefully in the original waffle pack container, carrier tape or other suitable container. Care must be taken that ceramic chips do
not come into contact with one another causing chip outs, cracks or other mechanical damage.
The recommended method for soldering large chips is reflow soldering. Wave soldering and manual soldering are not recommended.
Ceramic capacitors should be preheated to within 50°C of the peak soldering temperature and then use a maximum 2°C/second ramp
rate for both heating and cooling. A sudden increase or decrease in temperature during soldering may cause internal thermal cracks.
Available Options:
• HEC offers flexible termination (Super Term) for very large chips to minimize mechanical cracks due to board flexing.
• To minimize the potential for surface arcing in higher voltage applications, HEC offers the option of a proprietary surface coating.
• Pure tin terminated / ROHS compliant products are offered as standard, however, lead (Pb) content plated termination is also available.
• Pd/Ag termination is also available as an option for hybrid circuits and other applications.
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