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HSC Datasheet, PDF (1/4 Pages) Honeywell Solid State Electronics Center – TruStability silicon Pressure Sensors: HSC Series-High Accuracy +-1% total Error band,Analog output,SIP,1 psi to 150 psi | |||
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HSC Series-Stacked Capacitors
High Temperature and Large Size Multilayer Ceramic Chip Capacitors
[High Temperature / Large Stacked Capacitors]
HSC Series
Holy Stone
MLCC Design, Suitable for Switchmode Power Supply Filters
 Features
 Application
 High CV MLCC design, effectively can replace Tantalum  Down Hole Applications
and Aluminum electolytics
 Inherently low ESR.
 N leads for through hole applications and J or L lead
configuration for surface mount with stress relief against
board flexure and thermal excursions.
 High reliability testing available including space level
screening.
 Custom sizes and values available--contact factory for
details or to define your needs.
 Jet Engine Control
 Power supplies
 DC-DC converters
 Surge protection
 Industrial control circuits
 Snubbers
 Filtering, smoothing, and decoupling application
 HIREL applications
 Custom applications
 Summary of Specification
Operating Temperature
Rated Voltage
Temperature Coefficient of
Capacitance
Capacitance Range
Dissipation Factor :
Insulation Resistance
Aging
Dielectric Withstanding Voltage
Tolerance
-55 to +175 Ô¨
50Vdc to 500Vdc
NPO : ⤠± 30ppm/ Ԩ , -55 to +125 Ԩ (EIA Class Π)
X8R : ⤠± 15%
, -55 to +150 Ô¨ (EIA Class â
¡ )
NPO: 70nF to 9.0uF
X8R : 460nF to 220uF
NPO : Q ؤ1000 at 1KHz
X8R : 2.5%max. at 1KHz
10G⦠or 500/C ⦠whichever is smaller
NPO : 0% , X8R : 2.5% per decade of time
V â¤50V
; 250% Rated Voltage
100V ⤠V <500V ; 200% Rated Voltage
500V ⤠V
; 150% Rated Voltage
± 1% & ± 2% tolerances are only available in NPO
 How To Order
HSC
3A
J
H
224
K
501
W
H
01
Product
Code
Stack and Lead
Material
Size
Configuration
HSC:
The first digit: Ex.:
High
# of chips in J :J Lead
Temperature stack
L :L Lead
and Large
N:Straight
Size
Second Digit: Lead
Multilayer Chip Size
Ceramic A
Chip
B
Capacitor C
D
Ex.:
N: NPO
H: X8R
Capacitance Tolerance Rated
(pF)
Voltage
Packaging Special Test Special
Requirement Requirement
Ex.:
103:10x103
224:22x104
475:47x105
Ex.:
F: +/-1.0%
G: +/-2.0%
J: +/-5.0%
K: +/- 10%
M: +/- 20%
Ex.:
050:50Vdc
101:100Vdc
201:200Vdc
501:500Vdc
B: Bulk
W: Waffle
pack
Blank:
Blank:
Standard
No special
electrical test requirement
H:
01~99:
Hi-Rel
Customer
Testing
special
requirement
-1-
Revision date : 2010.07.16
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