HI-8448_16 Datasheet, PDF (9/9 Pages) Holt Integrated Circuits – ARINC 429 Line Receivers

HI-8444, HI-8445, HI-8448 PACKAGE DIMENSIONS
38-PIN PLASTIC TSSOP
millimeters (inches)
Package Type: 38HS
6.400 ± 0.150
(0.252 ± 0.006)
9.700 ± 0.100
(0.382 ± 0.004)
Pin 1
4.400 ± 0.100
(0.173 ± 0.004)
0.220 ± 0.050
(0.0087 ± 0.002)
0.145 ± 0.055
(0.006 ± 0.002)
See Detail A
0.925 ± 0.125
(0.036 ± 0.005)
0.500
(0.0197)
BSC
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
0° to 8°
0.600 ± 0.150
(0.024 ± 0.006)
0.100 ± 0.050
(0.004 ± 0.002)
Detail A
44-PIN PLASTIC CHIP-SCALE PACKAGE (QFN)
(07.2.0706)BSC
7.00
(0.276)
BSC
Top View
5.50 ± 0.050
(0.217 ± 0.002)
millimeters (inches)
Package Type: 44PCS
5.50 ± 0.050
(0.217 ± 0.002)
Bottom
View
0.50
(0.0197)
BSC
0.25 ± 0.050
(0.010 ± 0.002)
1.00
(0.039)
max
0.200 _typ
(0.008)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
Electrically isolated heat
sink pad on bottom of
package
Connect to any ground or
power plane for optimum
thermal dissipation
0.400 ± 0.050
(0.016 ± 0.002)
HOLT INTEGRATED CIRCUITS
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