HI-1573_13 Datasheet, PDF (10/11 Pages) Holt Integrated Circuits – MIL-STD-1553 3.3V Monolithic Dual Transceivers

PACKAGE DIMENSIONS
20-PIN PLASTIC SMALL OUTLINE (ESOIC) - WB
(Wide Body, Thermally Enhanced)
.504
(12.80)
BSC
.008 ± .005
(.215 ± .115)
inches (millimeters)
Package Type: 20HWE
.295 ± .015
(7.495 ± .385)
(1.400.373)^BSC
Top View
.295
(7.50)
BSC
.210 ± .015
(5.335 ± .385)
Bottom
View
.016 ± .004
(.419 ± .109)
See Detail A
.086 ± .005
(2.181 ± .131)
.050
(1.27)
BSC
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
0° to 8°
.033 ± .017
(.835 ± .435)
.008 ± .004
(.200 ± .100)
Detail A
Electrically isolated heat
sink pad on bottom of
package
Connect to any ground or
power plane for optimum
thermal dissipation
20-PIN CERAMIC SIDE-BRAZED DIP
inches (millimeters)
Package Type: 20C
1.000 ±.010
(25.400 ±.254)
.200
(5.080)
max
.050 TYP.
(1.270 TYP.)
.310 ±.010
(7.874 ±.254)
.085 ±.009
(2.159 ± .229)
.300 ± .010
(7.620 ± .254)
.125 _min
(3.175)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
.017 ±.002
(.432 ±.051)
.100
(2.54) ^BSC
HOLT INTEGRATED CIRCUITS
10
.010 + 0. 02/-.001
(.254 ±.051/-.025)