BS812A-1 Datasheet, PDF (4/27 Pages) Holtek Semiconductor Inc – Operating voltage: 2.2V~5.5V

BS818A-2
Pin name
Key1~Key8
OMS
LSC
Clock
Data
BIN3~BIN0
VSS
VDD
BS8112A-3
Pin name
Key1~Key12
IRQ
SCL
SDA
VSS
VDD
BS8116A-3
Pin name
Key1~Key16
IRQ
SCL
SDA
VSS
VDD
BS812A-1/BS813A-1/BS814A-1/BS814A-2
BS816A-1/BS818A-2/BS8112A-3/BS8116A-3
I/O
Input
Input
Input
Input
NMOS output
CMOS output
—
—
Description
Touch key input pin, unused touch keys require grounding
Output Mode Selection.
Open = 2-wire serial mode
Grounded = 4-wire binary parallel mode
Power-saving mode selection
Open=General power-saving mode
Grounded=More power-saving mode
2-wire series interface Clock input - internal pull- high
Series interface Data NMOS output - internal pull-high
Binary output mode
Negative power supply, ground
Positive power supply
I/O
Input
Output
Input / Output
Input / Output
—
—
Description
Touch key input pin, unused touch keys require grounding
Interrupt request or wake-up function, NMOS output with internal pull high
I²C clock input/output
I²C data input/output
Negative power supply, ground
Positive power supply
I/O
Input
Output
Input / Output
Input / Output
—
—
Description
Touch key input pin, unused touch keys require grounding
Interrupt request or wake-up function, NMOS output with internal pull high
I²C clock input/output
I²C data input/output
Negative power supply, ground
Positive power supply
Absolute Maximum Ratings
Supply Voltage.........................VSS -0.3V to VSS +6.5V
Input Voltage............................VSS -0.3V to VDD +0.3V
IOL Total............................................................... 80mA
IOH Total............................................................. -80mA
Storage Temperature............................ -50°C to 125°C
Operating Temperature.......................... -40°C to 85°C
Total Power Dissipation..................................500mW
Note: These are stress ratings only. Stresses exceeding the range specified under “Absolute Maximum Ratings”
may cause substantial damage to the device. Functional operation of this device at other conditions beyond
those listed in the specification is not implied and prolonged exposure to extreme conditions may affect
device reliability.
Rev. 1.32
4
January 19, 2016