HT8970 Datasheet, PDF (3/9 Pages) Holtek Semiconductor Inc – Voice Echo

Pad Assignment
HT8970
15 ¹⁴
D G N D ^{1 16}
13 12 11 10
(0 ,0 )
O S C _O
2
VCO
3
CC1 ⁴
5
6
7
8
9
Chip size: 1790 ´ 2215 (mm)²
* The IC substrate should be connected to VSS in the PCB layout artwork.
Pad Coordinates
Pad No. X
1
-698.00
2
-669.25
3
-669.25
4
-669.25
5
-405.55
6
-140.05
7
123.65
8
389.15
Y
701.70
-614.45
-762.85
-945.30
-945.30
-945.30
-945.30
-945.30
Pad No.
9
10
11
12
13
14
15
16
X
652.85
720.20
571.80
423.40
275.00
-77.60
-306.55
-560.95
Unit: mm
Y
-945.30
882.55
882.55
882.55
882.55
877.60
849.95
737.70
3
March 14, 2000