HT36A2 Datasheet, PDF (3/24 Pages) Holtek Semiconductor Inc – 8-Bit Music Synthesizer MCU

HT36A2
Pad Coordinates
Pad No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
X
-939.550
-939.550
-939.550
-939.550
-939.550
-939.550
-939.550
-939.550
301.450
413.250
526.890
636.250
761.700
924.250
899.200
Y
1222.175
1111.575
1011.575
900.975
800.975
690.375
590.375
479.775
-1303.400
-1303.400
-1303.400
-1303.400
-1296.750
-1296.750
-1078.450
Pad No.
16
17
18
19
20
21
22
23
24
25
26
27
28
29
X
899.200
899.200
938.800
938.800
938.800
938.800
-26.300
-136.900
-236.900
-347.500
-447.500
-558.100
-658.100
-768.700
Unit: mm
Y
-965.126
-287.274
-100.675
9.925
109.925
220.525
1336.775
1336.775
1336.775
1336.775
1336.775
1336.775
1336.775
1336.775
Pad Description
Pad Name
I/O
Internal
Connection
Function
PB0~PB7
I/O
Pull-High
or None
Bidirectional 8-bit Input/Output port
AUD
O
¾
Audio output for driving a external transistor or for driving HT82V733
TEST
¾
¾
No connection (open)
VDDA
¾
¾
DAC power supply
VDD
¾
¾
Positive power supply
VSSA
¾
¾
Negative power supply of DAC, ground
VSS
¾
¾
Negative power supply, ground
RES
I
¾
Reset input, active low
OSC1
OSC2
OSC1 and OSC2 are connected to an RC network or a crystal (by mask option)
I
O
¾
for the internal system clock. In the case of RC operation, OSC2 is the output
terminal for 1/8 system clock. The system clock may come from the crystal, the
two pins cannot be floating.
PC0~PC3
I/O
Pull-High
or None
Bidirectional 4-bit Input/Output port
PA0~PA7
I/O
Pull-High
or None
Bidirectional 8-bit Input/Output port, wake-up by mask option
Absolute Maximum Ratings
Supply Voltage .............................V_SS-0.3V to V_SS+6V
Input Voltage .............................V_SS-0_.3V to V_DD+0.3V
Storage Temperature ...........................-50°C to 125°C
Operating Temperature ..........................-25°C to 70°C
Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may
cause substantial damage to the device. Functional operation of this device at other conditions beyond those
listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliabil-
ity.
Rev. 1.00
3
June 19, 2003