SIB437EDKT Datasheet, PDF (1/8 Pages) Vishay Siliconix – P-Channel 8 V (D-S) MOSFET

New Product
P-Channel 8 V (D-S) MOSFET
SiB437EDKT
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
-8
R_DS(on) ()
0.034 at V_GS = - 4.5 V
0.063 at V_GS = - 1.8 V
0.084 at V_GS = - 1.5 V
0.180 at V_GS = - 1.2 V
I_D (A)
- 9^a
-5
-3
-1
Q_g (Typ.)
10.5 nC
Thin PowerPAK SC-75-6L-Single
FEATURES
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET^® Power MOSFET
• New Thermally Enhanced PowerPAK^®
SC-75 Package with ultra-thin 0.6 mm height
- Small Footprint Area
- Low On-Resistance
• 100 % R_g Tested
• Typical ESD Performance 2000 V
• Built in ESD Protection with Zener Diode
• Compliant to RoHS Directive 2002/95/EC
6^D
5^D
1.60 mm
4^S
APPLICATIONS
S
• Load Switch for Portable Devices
1
D
• Load Switch for Low Voltage Gate Drive
2
D
3
G
S
1.60 mm
0.60 mm
Marking Code
Part # code
BMX
XXX
Lot Traceability
and Date code
Ordering Information: SiB437EDKT-T1-GE3 (Lead (Pb)-free and Halogen-free)
G
R
D
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
-8
V
V_GS
±5
T_C = 25 °C
- 9^a
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
- 9^a
- 7.5^{b, c}
T_A = 70 °C
- 6^{b, c}
A
Pulsed Drain Current
I_DM
- 25
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
- 9^a
- 2^{b, c}
T_C = 25 °C
13
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
8.4
2.4^{b, c}
W
T_A = 70 °C
1.6^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_J, T_stg
- 55 to 150
°C
260
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Case (Drain)
t5s
R_thJA
41
Steady State
R_thJC
7.5
51
°C/W
9.5
Notes:
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See solder profile (www.vishay.com/ppg?73257). The Thin PowerPAK SC-75 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 105 °C/W.
Document Number: 67402
S11-0235-Rev. A, 14-Feb-11
www.vishay.com
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