E401201 Datasheet, PDF (2/2 Pages) HOKURIKU ELECTRIC INDUSTRY CO.,LTD – Double Sided (Silver / Copper) Polymer Through Hole Board

Double Sided (Silver / Copper) Polymer Through Hole Board
Characteristic (Reference Data)
Ag Th : Ag Paste (1.5mm pitch , FR-1 , t=1.6mm)
Cu Th : Copper Paste (1.5mm pitch , FR-1 , t=1.6mm )
250
200
150
100
50
0
0
High Temp. Test (100㷄)
Ag Th
Cu Th
250
500
750
1000
Time (Hr)
250
200
150
100
50
0
0
Load Life (70㷄 300mA)
Ag Th
Cu Th
250
500
750
1000
Time (Hr)
1.E+13
1.E+12
1.E+11
1.E+10
1.E+09
1.E+08
1.E+07
0
Migration (40㷄 90䌾95%Rh DC50V)䇭
Ag Th
500
1000
1500
2000
Time (Hr)
250
200
150
100
50
0
0
250
200
150
100
50
0
0
1.E+13
1.E+12
1.E+11
1.E+10
1.E+09
1.E+08
1.E+07
0
Humidity Test (60㷄 90䌾95%Rh)
Ag Th
Cu Th
250
500
750
1000
Time (Hr)
Humidity Load Life
(40㷄 90䌾95%Rh 300mA)
Ag Th
Cu Th
250
500
750
1000
Time (Hr)
Migration (60㷄 90䌾95%Rh DC100V)
Ag Th
Cu Th
500
1000
1500
2000
Time (Hr)
Solder Dipping
(260㷄 5sec 5Cycle)
250
Ag Th
Cu Th
200
150
100
50
0
Initial 1
3
5
Reflow Dipping
(230㷄 3sec 5Cycle)
250
Ag Th
200
Cu Th
Oil Dipping
(260㷄 10sec 100Cycle)
250
Ag Th
200
Cu Th
Heat Cycle (100Cycle)
(-40㷄 30min 100㷄 30min)
250
Ag Th
200
Cu Th
150
150
150
100
100
100
50
50
50
0
0
0
Initial 1
3
5
Initial 20
50
100
Initial
100
300
HOKURIKU
Specifications are subject to change without notice. 2