HMC708LP5 Datasheet, PDF (9/12 Pages) Hittite Microwave Corporation – 0.5 dB LSB 6-BIT DIGITAL VARIABLE GAIN AMPLIFIER, 1700 - 2200 MHz

Outline Drawing
HMC708LP5 / 708LP5E
v03.0409
0.5 dB LSB 6-BIT DIGITAL
VARIABLE GAIN AMPLIFIER, 1700 - 2200 MHz
13
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE
SOLDERED TO PCB RF GROUND.
7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED
LAND PATTERN.
Package Information
Part Number
Package Body Material
HMC708LP5
Low Stress Injection Molded Plastic
Lead Finish
Sn/Pb Solder
HMC708LP5E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
MSL Rating
MSL1 ^[1]
MSL1 ^[2]
Package Marking ^[3]
H708
XXXX
H708
XXXX
Pin Descriptions
Pin Number
Function
1
RFIN
2, 3, 21, 30
N/C
Description
RF input to the first amplifier (AMP1) This pin is DC coupled
and matched to 50 Ohms.
No connection necessary. These pins may be connected to
RF/DC ground without affecting performance.
Interface Schematic
4
RES
This pin is used to set the DC current of the first amplifier by
selection of external bias resistor. See application circuit.
13 - 104
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20 Alpha Road, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
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