HMC1057 Datasheet, PDF (9/12 Pages) Hittite Microwave Corporation – Military End-Use

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Table 1. Absolute Maximum Ratings
RF Power (LO = 13 dBm)
+7.5 dBm
LO Drive (RF = -10 dBm)
+20 dBm
IF Power
+5 dBm
Maximum Junction Temperature
175 °C
Thermal Resistance (R_TH)
(junction to die bottom)
258 °C/W
Operating Temperature
-55°C to +85°C
Storage Temperature
-65°C to 150°C
Outline Drawing
HMC1057
GaAs MMIC SUB HARMONIC
I/Q MIXER, 71 - 86 GHz
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Table 2. Die Packaging Information ^[1]
Standard
Alternate
GP-1 (Gel Pack)
[2]
[1] For more information refer to the “Packaging
information” Document in the Product Support Section of
our website.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM].
2. DIE THICKNESS IS 0.004”
3. BOND PADS 1, 2 & 3 are 0.0059” [0.150] X 0.0039” [0.099].
4. BACKSIDE METALLIZATION: GOLD.
5. BOND PAD METALLIZATION: GOLD.
6. BACKSIDE METAL IS GROUND.
7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.
8. Overall die size ± 0.002
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
9
Phone: [phone] Fax: [phone] Order On-line at www.hittite.com
Application Support: Phone: [phone] or [e-mail]