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HMC442LM1 Datasheet, PDF (8/8 Pages) Hittite Microwave Corporation – GaAs PHEMT MMIC MEDIUM POWER AMPLIFIER, 17.5 - 24 GHz | |||
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v01.1003
MICROWAVE CORPORATION
HMC442LM1
GaAs PHEMT MMIC MEDIUM
POWER AMPLIFIER, 17.5 - 24 GHz
Recommended SMT Attachment Technique
8
Preparation & Handling of the LM1 Microwave Package for Surface Mounting
The HMC LM1 package was designed to be compatible with high volume
surface mount PCB assembly processes. The LM1 package requires a 225
speciï¬c mounting pattern to allow proper mechanical attachment and to 200
optimize electrical performance at millimeterwave frequencies. This PCB
layout pattern can be found on each LM1 product data sheet. It can also 175
be provided as an electronic drawing upon request from Hittite Sales & 150
Application Engineering.
125
Follow these precautions to avoid permanent damage:
100
Cleanliness: Observe proper handling procedures to ensure clean devices
and PCBs. LM1 devices should remain in their original packaging until
component placement to ensure no contamination or damage to RF, DC &
ground contact areas.
Static Sensitivity: Follow ESD precautions to protect against ESD strikes.
75
50
25
0
1
2
3
4
5
6
7
8
TIME (min)
General Handling: Handle the LM1 package on the top with a vacuum collet or along the edges with a sharp pair of bent tweezers.
Avoiding damaging the RF, DC, & ground contacts on the package bottom. Do not apply excess pressure to the top of the lid.
Solder Materials & Temperature Proï¬le: Follow the information contained in the application note. Hand soldering is not recommended.
Conductive epoxy attachment is not recommended.
Solder Paste: Solder paste should be selected based on the userâs experience and be compatible with the metallization systems used.
See the LM1 data sheet Outline drawing for pin & ground contact metallization schemes.
Solder Paste Application: Solder paste is generally applied to the PCB using either a stencil printer or dot placement. The volume of
solder paste will be dependent on PCB and component layout and should be controlled to ensure consistent mechanical & electrical
performance. Excess solder may create unwanted electrical parasitics at high frequencies.
Solder Reï¬ow: The soldering process is usually accomplished in a reï¬ow oven but may also use a vapor phase process. A solder
reï¬ow proï¬le is suggested above.
Prior to reï¬owing product, temperature proï¬les should be measured using the same mass as the actual assemblies. The thermocouple
should be moved to various positions on the board to account for edge and corner effects and varying component masses. The ï¬nal
proï¬le should be determined by mounting the thermocouple to the PCB at the location of the device.
Follow solder paste and oven vendorâs recommendations when developing a solder reï¬ow proï¬le. A standard proï¬le will have a steady
ramp up from room temperature to the pre-heat temperature to avoid damage due to thermal shock. Allow enough time between
reaching pre-heat temperature and reï¬ow for the solvent in the paste to evaporate and the ï¬ux to completely activate. Reï¬ow must
then occur prior to the ï¬ux being completely driven off. The duration of peak reï¬ow temperature should not exceed 15 seconds.
Packages have been qualiï¬ed to withstand a peak temperature of 235°C for 15 seconds. Verify that the proï¬le will not expose device
to temperatures in excess of 235°C.
Cleaning: A water-based ï¬ux wash may be used.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
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