HMC722LC3C Datasheet, PDF (7/8 Pages) Hittite Microwave Corporation – 13 Gbps, FAST RISE TIME AND/NAND/OR/NOR GATE, w/ PROGRAMMABLE OUTPUT VOLTAGE

Evaluation PCB
3
HMC722LC3C
v03.1209
13 Gbps, FAST RISE TIME AND/NAND/OR/NOR
GATE, w/ PROGRAMMABLE OUTPUT VOLTAGE
Item
J1
J2
J3
J4
J5
J6
J7
J8
J9
Description
AN
AP
BN
BP
DP
DN
Vee
VR
GND
List of Materials for Evaluation PCB 118777 ^[1]
Item
J1 - J6
Description
PCB Mount SMA RF Connectors
The circuit board used in the application should use
RF circuit design techniques. Signal lines should
J7 - J9
DC Pin
have 50 Ohm impedance while the package gro-
C1, C2
100 pF Capacitor, 0402 Pkg.
und leads should be connected directly to the
C3, C4
4.7 µF Capacitor, Tantalum
ground plane similar to that shown. The exposed
R1
10 Ohm Resistor, 0603 Pkg.
package base should be connected to Vee. A suffi-
U1
HMC722LC3C
High Speed Logic, AND / NAND / OR / NOR
PCB ^[2]
118775 Evaluation Board
[1] Reference this number when ordering complete evaluation PCB
[2] Circuit Board Material: Rogers 4350
cient number of via holes should be used to connect
the top and bottom ground planes. The evaluation
circuit board shown is available from Hittite upon
request.
3-7
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
Phone: [phone] Fax: [phone] Order On-line at www.hittite.com
Application Support: Phone: [phone] or [e-mail]