HMC687LP4_10 Datasheet, PDF (7/10 Pages) Hittite Microwave Corporation – BiCMOS MMIC MIXER W/ INTEGRATED LO AMPLIFIER, 1.7 - 2.2 GHz

Outline Drawing
10
v04.0509
HMC687LP4 / 687LP4E
BiCMOS MMIC MIXER W/ INTEGRATED
LO AMPLIFIER, 1.7 - 2.2 GHz
NOTES:
1. PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED
PLASTIC SILICA AND SILICON IMPREGNATED.
2. LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY.
3. LEAD AND GROUND PADDLE PLATING: 100% MATTE TIN.
4. DIMENSIONS ARE IN INCHES [MILLIMETERS].
5. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
6. PAD BURR LENGTH SHALL BE 0.15mm MAX.
PAD BURR HEIGHT SHALL BE 0.25mm MAX.
7. PACKAGE WARP SHALL NOT EXCEED 0.05mm
8. ALL GROUND LEADS AND GROUND PADDLE
MUST BE SOLDERED TO PCB RF GROUND.
9. REFER TO HITTITE APPLICATION NOTE
FOR SUGGESTED PCB LAND PATTERN.
Package Information
Part Number
Package Body Material
HMC687LP4
Low Stress Injection Molded Plastic
Lead Finish
Sn/Pb Solder
HMC687LP4E RoHS-compliant Low Stress Injection Molded Plastic
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
100% matte Sn
MSL Rating
MSL1 ^[1]
MSL1 ^[2]
Package Marking ^[3]
H687
XXXX
H687
XXXX
10 - 7
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
Phone: [phone] Fax: [phone] Order On-line at www.hittite.com
Application Support: Phone: [phone] or [e-mail]