HMC461LP3_09 Datasheet, PDF (7/8 Pages) Hittite Microwave Corporation – InGaP HBT 1 Watt High IP3 AMPLIFIER, 1.7 - 2.2 GHz

v02.0705
Evaluation PCB
11
HMC461LP3 / 461LP3E
InGaP HBT 1 Watt High IP3
AMPLIFIER, 1.7 - 2.2 GHz
J3, J4
Pin Number
1, 2, 3
4, 5, 6
Description
GND
Vs
11 - 256
List of Materials for Evaluation PCB 106485 ^[1]
Item
J1, J2
J3, J4
C1, C2
C3, C4
C5, C6
C7, C8
C9, C10
L1, L2
U1
Description
PCB Mount SMA Connector
2 mm DC Header
2.2 μF Capacitor, Tantalum
100 pF Capacitor, 0402 Pkg.
5 pF Capacitor, 0402 Pkg.
0.8 pF Capacitor, 0402 Pkg.
4 pF Capacitor, 0402 Pkg.
8.2 nH Inductor, 0402 Pkg.
HMC461LP3 / HMC461LP3E
Power Amplifier
The circuit board used in the final application should
use RF circuit design techniques. Signal lines
should have 50 ohm impedance while the package
ground leads and exposed paddle should be con-
nected directly to the ground plane similar to that
shown. A sufficient number of via holes should be
used to connect the top and bottom ground planes.
The evaluation board should be mounted to an
appropriate heat sink. The evaluation circuit board
shown is available from Hittite upon request.
U2, U3
PCB ^[2]
Panasonic Balun, P/N EHFFD - 1619
106483 Evaluation PCB, 10 mils
[1] Reference this number when ordering complete evaluation PCB
[2] Circuit Board Material: Rogers 4350, Er = 3.48
Specifications and data reflect HMC461LP3 measured with external baluns in a balanced
amplifier configuration optimized for 1.85 - 2.2 GHz per application circuit herein.
Contact HMC Applications for 1.7 - 1.85 GHz performance optimization.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
Order On-line at www.hittite.com