HMC750LP4 Datasheet, PDF (6/10 Pages) Hittite Microwave Corporation – 12.5 Gbps LIMITING AMPLIFIER

v00.1108
Outline Drawing
HMC750LP4 / 750LP4E
12.5 Gbps LIMITING AMPLIFIER
10
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS].
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND.
7. REFER TO HMC APPLICATION NOTE FOR SUGGESTED PCB LAND PATTERN.
Package Information
Part Number
Package Body Material
HMC750LP4
Low Stress Injection Molded Plastic
Lead Finish
Sn/Pb Solder
HMC750LP4E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
MSL Rating
MSL1 ^[1]
MSL1 ^[2]
Package Marking ^[3]
H750
XXXX
H750
XXXX
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
Order On-line at www.hittite.com
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