HMC593LP3_09 Datasheet, PDF (6/8 Pages) Hittite Microwave Corporation – GaAs PHEMT MMIC LOW NOISE AMPLIFIER w/ BYPASS MODE, 3.3 - 3.8 GHz

HMC593LP3 / 593LP3E
v03.0309
GaAs PHEMT MMIC LOW NOISE
AMPLIFIER w/ BYPASS MODE, 3.3 - 3.8 GHz
Bypass Mode, Psat vs. Temperature
0
-1
-2
-3
-4
+25C
+85C
-40C
-5
3.3
3.4
3.5
3.6
3.7
3.8
FREQUENCY (GHz)
Outline Drawing
Typical Supply Current vs. Vdd
Vdd (V)
+2.4
+2.7
+3.0
+4.5
+5.0
+5.5
Idd (mA)
9
12
16
33
39
44
Absolute Maximum Ratings
Drain Bias Voltage (Vdd)
+8 V
RF Input Power (RFIN)
(Vdd = +5.0 Vdc)
LNA Mode +15 dBm
Bypass Mode +30 dBm
Channel Temperature
150 °C
Continuous Pdiss (T = 85 °C)
(derate 13 mW/°C above 85 °C)
850 mW
Thermal Resistance
(channel to ground paddle)
76.9 °C/W
Storage Temperature
-65 to +150° C
Operating Temperature
-40 to +85° C
ESD Sensitivity (HBM)
Class 1A
8
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND.
7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED LAND PATTERN.
Package Information
Part Number
Package Body Material
HMC593LP3
Low Stress Injection Molded Plastic
Lead Finish
Sn/Pb Solder
HMC593LP3E RoHS-compliant Low Stress Injection Molded Plastic
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
100% matte Sn
MSL Rating
MSL1 ^[1]
MSL1 ^[2]
Package Marking ^[3]
593
XXXX
593
XXXX
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
Order On-line at www.hittite.com
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