HMC663LC3_10 Datasheet, PDF (5/6 Pages) Hittite Microwave Corporation – GaAs MMIC DOUBLE-BALANCED HIGH IP3 Mixer, 6 - 12 GHz

v03.0709
Outline Drawing
10
HMC663LC3
GaAs MMIC DOUBLE-BALANCED
HIGH IP3 Mixer, 6 - 12 GHz
NOTES:
1. PACKAGE BODY MATERIAL: ALUMINA.
2. LEAD AND GROUND PADDLE PLATING:
30-80 MICROINCHES GOLD OVER 50 MICROINCHES MINIMUM NICKEL.
3. DIMENSIONS ARE IN INCHES (MILLIMETERS).
4. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
5. CHARACTERS TO BE HELVETICA MEDIUM, .025 HIGH, BLACK INK,
OR LASER MARK LOCATED APPROX. AS SHOWN.
6. PACKAGE WARP SHALL NOT EXCEED 0.05MM DATUM – C –
7. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED
TO PCB RF GROUND.
8. CLASSIFIED AS MOISTURE SENSITIVITY LEVEL (MSL) 1.
Pin Descriptions
Pin Number
1, 4, 5,
8 - 13, 16
2
Function
N/C
LO
3, 6, 15
GND
7
IF
14
RF
Description
Not Connected
This pin is AC coupled
and matched to 50 Ohms.
These pins and package base must
be connected to RF/DC ground.
This pad is DC coupled. For applications not requiring
operation to DC, this port should be DC blocked externally
using a series capacitor whose value has been chosen to
pass the necessary IF frequency range. For operation to DC,
this pin must not source or sink more than 2 mA of current or
part non-function and possible part failure will result.
This pin is AC coupled
and matched to 50 Ohms.
Interface Schematic
10 - 5
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