HMC622LP4 Datasheet, PDF (5/10 Pages) Hittite Microwave Corporation – GaAs MMIC MIXER w/ INTEGRATED IF & LO AMPLIFIER, 1.8 - 3.9 GHz

Outline Drawing
v01.0508
HMC622LP4 / 622LP4E
GaAs MMIC MIXER w/ INTEGRATED
IF & LO AMPLIFIER, 1.8 - 3.9 GHz
9
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE
SOLDERED TO PCB RF GROUND.
7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED
LAND PATTERN.
Package Information
Part Number
HMC622LP4
Package Body Material
Low Stress Injection Molded Plastic
Lead Finish
Sn/Pb Solder
HMC622LP4E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
MSL Rating
MSL1 ^[1]
MSL1 ^[2]
Package Marking ^[3]
H622
XXXX
H622
XXXX
Pin Descriptions
Pin Number
1, 2, 4, 5, 6, 8,
11, 14, 15, 19,
20, 22 - 24
Function
N/C
3
RF
Description
No connection. These pins may be connected to
RF ground. Performance will not be affected.
This pin is DC coupled and
matched to 50 Ohms.
Interface Schematic
9 - 376
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
Order On-line at www.hittite.com