HMC258_09 Datasheet, PDF (5/6 Pages) Hittite Microwave Corporation – GaAs MMIC SUB-HARMONICALLY PUMPED MIXER, 14 - 21 GHz

Outline Drawing
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v03.1007
HMC258
GaAs MMIC SUB-HARMONICALLY
PUMPED MIXER, 14 - 21 GHz
Die Packaging Information ^[1]
Standard
Alternate
WP-8 (Waffle Pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM].
2. BOND PADS ARE .004” SQUARE.
3. TYPICAL BOND PAD SPACING CENTER TO CENTER IS .006”.
4. BACKSIDE METALLIZATION: GOLD.
5. BOND PAD METALLIZATION: GOLD.
6. BACKSIDE METAL IS GROUND.
7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.
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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
Order On-line at www.hittite.com