HMC695LP4_10 Datasheet, PDF (4/6 Pages) Hittite Microwave Corporation – SMT GaAs HBT MMIC x4 ACTIVE FREQUENCY MULTIPLIER, 11.4 - 13.2 GHz OUTPUT

Outline Drawing
HMC695LP4 / 695LP4E
v01.1109
SMT GaAs HBT MMIC x4 ACTIVE
FREQUENCY MULTIPLIER, 11.4 - 13.2 GHz OUTPUT
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NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE
SOLDERED TO PCB RF GROUND.
7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED
LAND PATTERN.
Package Information
Part Number
Package Body Material
HMC695LP4
Low Stress Injection Molded Plastic
Lead Finish
Sn/Pb Solder
HMC695LP4E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
MSL Rating
MSL1 ^[1]
MSL1 ^[2]
Package Marking ^[3]
H695
XXXX
H695
XXXX
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
Phone: [phone] Fax: [phone] Order On-line at www.hittite.com
Application Support: Phone: [phone] or [e-mail]
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