HMC641 Datasheet, PDF (4/6 Pages) Hittite Microwave Corporation – GaAs MMIC SP4T NON-REFLECTIVE SWITCH, DC - 18 GHz

Outline Drawing
v01.0108
HMC641
GaAs MMIC SP4T NON-REFLECTIVE
SWITCH, DC - 18 GHz
4
Die Packaging Information ^[1]
Standard
Alternate
WP-18 (Waffle Pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
NOTES:
1. DIMENSIONS IN INCHES [MILLIMETERS].
2. DIE THICKNESS IS 0.004”.
3. TYPICAL BOND PAD IS 0.004” SQUARE.
4. TYPICAL BOND PAD SPACING IS 0.006” CENTER TO CENTER.
5. BOND PAD METALLIZATION: GOLD.
6. BACKSIDE METALLIZATION: GOLD.
7. BACKSIDE METAL IS GROUND.
8. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
Order On-line at www.hittite.com
4 - 41