HMC607 Datasheet, PDF (4/6 Pages) Hittite Microwave Corporation – GaAs MMIC HIGH ISOLATION SPDT SWITCH, DC - 15 GHz

v00.0307
Outline Drawing
HMC607
GaAs MMIC HIGH ISOLATION
SPDT SWITCH, DC - 15 GHz
4
NOTES:
1. PACKAGE BODY MATERIAL: WHITE ALUMINA 92%
2. CONDUCTOR TRACES MATERIAL: THICK FILM TUNGSTEN.
3. LEAD, BASE, COVER MATERIAL: KOVAR™.
4. PLATING: ELECTROLYTIC GOLD 50 MICROINCHES MIN, OVER
ELECTROLYTIC NICKEL 50 MICROINCHES MIN.
5. ALL DIMENSIONS ARE IN INCHES [MILLIMETERS].
6. TOLERANCES: .±005 [0.13] UNLESS OTHERWISE SPECIFIED.
7. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED
TO PCB RF GROUND.
Pad Descriptions
Pad Number
Function
1, 4, 7
RF1, RFC, RF2
2, 10
B
3, 11
B
5, 8
A
6, 9
A
Description
This pin is DC coupled and matched to 50 Ohm. Blocking
capacitors are required if RF line potential is not equal to 0V.
See truth table and control voltage table.
Alternate A & B control pads provided.
Die Bottom
GND
Die bottom must be connected to RF ground.
Interface Schematic
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
Order On-line at www.hittite.com
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