HMC561_09 Datasheet, PDF (4/6 Pages) Hittite Microwave Corporation – GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 8 - 21 GHz OUTPUT

Outline Drawing
v02.0809
HMC561
GaAs MMIC x2 ACTIVE FREQUENCY
MULTIPLIER, 8 - 21 GHz OUTPUT
2
Die Packaging Information ^[1]
Standard
Alternate ^[2]
GP-2 (Gel Pack)
—
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] Reference this suffix only when ordering alternate die
packaging.
Pin Description
Pin Number
Function
Description
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MILLIMETERS].
2. DIE THICKNESS IS .004”
3. TYPICAL BOND PAD IS .004” SQUARE.
4. TYPICAL BOND SPACING IS .006” CENTER TO CENTER.
5. BOND PAD METALIZATION: GOLD
6. BACKSIDE METALIZATION: GOLD
7. BACKSIDE METAL IS GROUND.
8. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS.
Interface Schematic
1, 4, 8
GND
Die bottom must be connected to RF ground.
2
RFIN
Pin is AC coupled and matched to 50 Ohms.
Gate control for multiplier. Adjust to achieve Idd
3
Vgg
of 98 mA. Please follow “MMIC Amplifier Biasing
Procedure” Application note.
5, 6
Vdd1, Vdd2
Supply voltage 5V ± 0.5V.
7
RFOUT
Pin is AC coupled and matched to 50 Ohms.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
Order On-line at www.hittite.com
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