HMC560_09 Datasheet, PDF (4/6 Pages) Hittite Microwave Corporation – GaAs MMIC FUNDAMENTAL MIXER, 24 - 40 GHz

v01.0408
Absolute Maximum Ratings
RF / IF Input
LO Drive
IF DC Current
Channel Temperature
Continuous Pdiss (T= 85 °C )
(derate 14.79 mW/ °C above 85 °C)
Thermal Resistance (R_TH)
(channel to die bottom)
Storage Temperature
Operating Temperature
+25 dBm
+23 dBm
±2 mA
150 °C/W
0.961 W
67.6 °C/W
-65 to +150 °C
-55 to +85 °C
HMC560
GaAs MMIC FUNDAMENTAL
MIXER, 24 - 40 GHz
MxN Spurious Outputs
as a Down Converter
nLO
mRF
0
1
2
3
0
xx
-9
-13
1
-10
0
-40
2
-68
-55
-55
-66
3
-82
-84
-66
RF = 24 GHz @ -10 dBm
LO = 25 GHz @ +13 dBm
All values in dBc below IF output power level.
4
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Outline Drawing
Die Packaging Information ^[1]
Standard
Alternate
WP-7 (Waffle Pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM].
2. DIE THICKNESS IS .004”.
3. TYPICAL BOND PAD IS .004” SQUARE.
4. BACKSIDE METALLIZATION: GOLD.
5. BOND PAD METALLIZATION: GOLD.
6. BACKSIDE METAL IS GROUND.
7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.
8. THIS DIE IS DESIGNED FOR PICK-UP WITH VACUUM (EDGE) COLLET TOOLS.
TO PRECLUDE THE RISK OF PERMANENT DAMAGE, NO CONTACT TO THE
DIE SURFACE IS ALLOWED WITHIN THIS RECTANGULAR AREA.
9. OVERALL DIE SIZE IS ±0.002”
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
Order On-line at www.hittite.com
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