HMC556_09 Datasheet, PDF (4/6 Pages) Hittite Microwave Corporation – GaAs MMIC I/Q MIXER 36 - 41 GHz

v00.0106
Absolute Maximum Ratings
RF Input
IF1 / IF2 Input
LO Drive
Channel Temperature
+19 dBm
+24 dBm
+27 dBm
150°C
Continuous Pdiss (T=85°C)
(derate 8.95 mW/°C above 85°C)
582 mW
Thermal Resistance (R )
TH
(channel to die bottom)
Storage Temperature
Operating Temperature
ESD Sensitivity (HBM)
111.6 °C/W
-65 to +150 °C
-55 to +85 °C
Class 1A
Outline Drawing
HMC556
GaAs MMIC I/Q MIXER
36 - 41 GHz
MxN Spurious Outputs
nLO
mRF
0
1
2
3
4
0
xx
-12
xx
xx
xx
1
22
0
44
xx
xx
2
xx
55
60
56
xx
3
xx
xx
87
78
89
4
xx
xx
xx
85
104
RF = 39.1 GHz @ -10 dBm
LO = 39 GHz @ +17 dBm
Data taken without IF hybrid
All values in dBc below IF power level
3
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. DIE THICKNESS IS .004”
3. TYPICAL BOND PAD IS .004”
4. BACKSIDE METALIZATION: GOLD
5. BOND PAD METALIZATION: GOLD
6. BACKSIDE METAL IS GROUND
7. CONNECTION NOT REQUIRED FOR
UNLABELED BOND PADS.
8. OVERALL DIE SIZE ±.002”
9. THIS DIE IS DESIGNED FOR PICK-UP WITH
VACUUM (EDGE) COLLET TOOLS. TO PRECLUDE
THE RISK OF PERMANENT DAMAGE, NO CONTACT
TO THE DIE SURFACE IS ALLOWED WITHIN THIS
RECTANGULAR AREA.
Die Packaging Information ^[1]
Standard
Alternate
WP-3 (Waffle Pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
Order On-line at www.hittite.com
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