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HMC528_09 Datasheet, PDF (4/6 Pages) Hittite Microwave Corporation – GaAs MMIC I/Q MIXER 11 - 16 GHz
v01.0907
Harmonics of LO
LO Freq. (GHz)
nLO Spur at RF Port
1
2
3
4
10.5
43
49
58
79
11.5
49
47
61
61
12.5
50
51
63
53
13.5
49
52
67
xx
14.5
50
48
69
xx
15.5
49
54
71
xx
LO = +19 dBm
Values in dBc below input LO level measured at RF Port.
Absolute Maximum Ratings
RF / IF Input
LO Drive
Channel Temperature
+20 dBm
27 dBm
150°C
Continuous Pdiss (T=85°C)
(derate 6.9 mW/°C above 85°C)
452 mW
Thermal Resistance (R )
TH
(junction to die bottom)
Storage Temperature
Operating Temperature
150 °C/W
-65 to +150 °C
-55 to +85 deg °C
Outline Drawing
HMC528
GaAs MMIC I/Q MIXER
11 - 16 GHz
MxN Spurious Outputs
nLO
mRF
0
1
2
3
4
0
xx
-12
7
14
xx
1
24
0
51
59
70
2
79
73
74
79
91
3
87
102
99
86
97
4
xx
84
102
97
105
RF = 13.6 GHz @ -10 dBm
LO = 13.5 GHz @ +19 dBm
Data taken without IF hybrid
All values in dBc below IF power level
3
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Die Packaging Information [1]
Standard
Alternate
GP-2 (Gel Pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. DIE THICKNESS IS .004”
3. TYPICAL BOND PAD IS .004”
4. BACKSIDE METALIZATION: GOLD
5. BOND PAD METALIZATION: GOLD
6. BACKSIDE METAL IS GROUND
7. CONNECTION NOT REQUIRED FOR
UNLABELED BOND PADS.
8. OVERALL DIE SIZE ±.002”
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
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