HMC527_09 Datasheet, PDF (4/6 Pages) Hittite Microwave Corporation – GaAs MMIC I/Q MIXER 8.5 - 13.5 GHz

v01.1007
Harmonics of LO
LO Freq. (GHz)
nLO Spur at RF Port
1
2
3
4
8.5
43
48
50
77
9.5
48
47
57
64
10.5
53
51
62
53
11.5
50
57
67
45
12.5
48
52
67
47
13.5
44
51
64
xx
LO = +19 dBm
Values in dBc below input LO level measured at RF Port.
Absolute Maximum Ratings
RF / IF Input
LO Drive
Channel Temperature
+20 dBm
+27 dBm
150°C
Continuous Pdiss (T=85°C)
(derate 7.1 mW/°C above 85°C)
460 mW
Thermal Resistance (R )
TH
(junction to die bottom)
Storage Temperature
Operating Temperature
140 °C/W
-65 to +150 °C
-55 to +85 deg °C
Outline Drawing
HMC527
GaAs MMIC I/Q MIXER
8.5 - 13.5 GHz
MxN Spurious Outputs
nLO
mRF
0
1
2
3
4
0
xx
-11
16
22
38
1
33
0
53
62
95
2
86
77
76
78
94
3
96
95
101
91
102
4
89
94
96
101
107
RF = 10.6 GHz @ -10 dBm
LO = 10.5 GHz @ +19 dBm
Data taken without IF hybrid
All values in dBc below IF power level
3
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Die Packaging Information ^[1]
Standard
Alternate
GP-2 (Gel Pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. DIE THICKNESS IS .004”
3. TYPICAL BOND PAD IS .004”
4. BACKSIDE METALIZATION: GOLD
5. BOND PAD METALIZATION: GOLD
6. BACKSIDE METAL IS GROUND
7. CONNECTION NOT REQUIRED FOR
UNLABELED BOND PADS.
8. OVERALL DIE SIZE ±.002”
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
Order On-line at www.hittite.com
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