HMC525 Datasheet, PDF (4/6 Pages) Hittite Microwave Corporation – GaAs MMIC I/Q MIXER 4.0 - 8.5 GHz

v00.1104
Harmonics of LO
LO Freq. (GHz)
nLO Spur at RF Port
1
2
3
4
3.5
40
40
54
50
4.5
43
45
58
53
5.5
51
57
48
67
6.5
59
63
64
56
7.5
48
66
64
62
8.5
44
65
60
67
LO = +15 dBm
Values in dBc below input LO level measured at RF Port.
Absolute Maximum Ratings
RF / IF Input
LO Drive
Channel Temperature
+20 dBm
+27 dBm
150°C
Continuous Pdiss (T=85°C)
(derate 9.7 mW/°C above 85°C)
631 mW
Thermal Resistance (R )
TH
(junction to die bottom)
Storage Temperature
Operating Temperature
103 °C/W
-65 to +150 °C
-55 to +85 deg °C
Outline Drawing
HMC525
GaAs MMIC I/Q MIXER
4.0 - 8.5 GHz
MxN Spurious Outputs
nLO
mRF
0
1
2
3
4
0
xx
-11
32
23
51
1
32
0
42
51
66
2
89
62
74
65
89
3
89
89
89
82
89
4
89
89
89
89
89
RF = 5.6 GHz @ -10 dBm
LO = 5.5 GHz @ +15 dBm
Data taken without IF hybrid
All values in dBc below IF power level
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Die Packaging Information ^[1]
Standard
Alternate
GP-2
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. DIE THICKNESS IS .004”
3. TYPICAL BOND PAD IS .004” SQUARE
4. BACKSIDE METALIZATION: GOLD
5. BOND PAD METALIZATION: GOLD
6. BACKSIDE METAL IS GROUND
7. CONNECTION NOT REQUIRED FOR
UNLABELED BOND PADS.
8. OVERALL DIE SIZE ±.002”
3
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
Order On-line at www.hittite.com
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