HMC522_09 Datasheet, PDF (4/6 Pages) Hittite Microwave Corporation – GaAs MMIC I/Q MIXER 11 - 16 GHz

v01.1007
Harmonics of LO
LO Freq. (GHz)
nLO Spur at RF Port
1
2
3
4
10.5
43
46
52
80
11.5
48
49
61
76
12.5
48
51
63
61
13.5
44
60
67
xx
14.5
44
58
82
xx
15.5
43
51
75
xx
LO = + 15 dBm
Values in dBc below input LO level measured at RF Port.
Absolute Maximum Ratings
RF / IF Input
LO Drive
Channel Temperature
Continuous Pdiss (T=85°C)
(derate 6.9 mW/°C above 85°C)
Thermal Resistance (R )
TH
(junction to die bottom)
Storage Temperature
Operating Temperature
+20 dBm
+27 dBm
150°C
452 mW
150 °C/W
-65 to +150 °C
-55 to +85 deg °C
Outline Drawing
HMC522
GaAs MMIC I/Q MIXER
11 - 16 GHz
MxN Spurious Outputs
nLO
mRF
0
1
2
3
4
0
xx
-4
18
18
xx
1
27
0
54
57
64
2
83
69
70
77
91
3
85
93
93
81
93
4
xx
86
93
92
93
RF = 13.6 GHz @ -10 dBm
LO = 13.5 GHz @ +15 dBm
Data taken without IF hybrid
All values in dBc below IF power level
3
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Die Packaging Information ^[1]
Standard
Alternate
GP-2 (Gel Pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. DIE THICKNESS IS .004”
3. TYPICAL BOND PAD IS .004”
4. BACKSIDE METALIZATION: GOLD
5. BOND PAD METALIZATION: GOLD
6. BACKSIDE METAL IS GROUND
7. CONNECTION NOT REQUIRED FOR
UNLABELED BOND PADS.
8. OVERALL DIE SIZE ±.002”
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
Order On-line at www.hittite.com
3 - 79