HMC511LP5_11 Datasheet, PDF (4/6 Pages) Hittite Microwave Corporation – MMIC VCO w/ HALF FREQUENCY OUTPUT 9.05 - 10.15 GHz

v04.0811
Outline Drawing
HMC511LP5 / 511LP5E
MMIC VCO w/ HALF FREQUENCY
OUTPUT 9.05 - 10.15 GHz
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE
SOLDERED TO PCB RF GROUND.
7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED
LAND PATTERN.
Package Information
Part Number
Package Body Material
HMC511LP5
Low Stress Injection Molded Plastic
Lead Finish
Sn/Pb Solder
HMC511LP5E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
MSL Rating
MSL3 ^[1]
MSL3 ^[2]
Package Marking ^[3]
H511
XXXX
H511
XXXX
8
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
Phone: [phone] Fax: [phone] Order On-line at www.hittite.com
Application Support: Phone: [phone] or [e-mail]
8-4