HMC486LP5_10 Datasheet, PDF (4/6 Pages) Hittite Microwave Corporation – SURFACE MOUNT PHEMT 2 WATT POWER AMPLIFIER, 7 - 9 GHz

HMC486LP5 / 486LP5E
v01.0705
SURFACE MOUNT PHEMT 2 WATT POWER
AMPLIFIER, 7 - 9 GHz
Power Dissipation*
10.5
Max Pdiss @ +85C
10
9.5
9
8.5
8
8 GHz
7.5
7
-10
-6
-2
2
6
10
14
18
INPUT POWER (dBm)
* Please refer to “Thermal Management for Surface Mount
Components” application note at www.hittite.com/
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Outline Drawing
Typical Supply Current vs. Vdd
Vdd (V)
Idd (mA)
+6.5
1330
+7.0
1300
+7.5
1285
Note: Amplifier will operate over full voltage ranges shown
above. Vgg adjusted to achieve Idd= 1300 mA at +7V.
Absolute Maximum Ratings
Drain Bias Voltage (Vdd1, 2, 3, 4, 5)
Gate Bias Voltage (Vgg)
RF Input Power (RFIN)(Vdd = +7V)
Channel Temperature
Continuous Pdiss (T = 85 °C)
(derate 154 mW/°C above 85 °C)
Thermal Resistance
(channel to ground paddle)
Storage Temperature
Operating Temperature
+8V
-2 to 0V
+20 dBm
150 °C
10 W
6.5 °C/W
-65 to +150 °C
-40 to +85 °C
11
Package Information
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND.
7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED LAND PATTERN.
Part Number
HMC486LP5
Package Body Material
Low Stress Injection Molded Plastic
Lead Finish
Sn/Pb Solder
HMC486LP5E RoHS-compliant Low Stress Injection Molded Plastic
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
100% matte Sn
MSL Rating
MSL1 ^[1]
MSL1 ^[2]
Package Marking ^[3]
H486
XXXX
H486
XXXX
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
Order On-line at www.hittite.com
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