HMC266 Datasheet, PDF (4/6 Pages) Hittite Microwave Corporation – GaAs MMIC SUB-HARMONICALLY PUMPED MIXER, 20 - 40 GHz

v01.0300
MICROWAVE CORPORATION
HMC266
GaAs MMIC SUB-HARMONICALLY
PUMPED MIXER, 20 - 40 GHz
Absolute Maximum Ratings
RF / IF Input
LO Drive
Storage Temperature
Operating Temperature
+13 dBm
+23 dBm
-65 to +150 °C
-55 to +85 °C
5
Outline Drawing (See Handling Mounting Bonding)
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM].
2. TYPICAL BOND PAD IS .004” SQUARE.
3. BOND PAD SPACING CENTER TO CENTER IS .006”.
4. BACKSIDE METALLIZATION: GOLD.
5. BOND PAD METALLIZATION: GOLD.
6. BACKSIDE METAL IS GROUND.
7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
Order Online at www.hittite.com
5 - 67