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HMC130_09 Datasheet, PDF (4/6 Pages) Hittite Microwave Corporation – GaAs MMIC DOUBLE-BALANCED MIXER, 6 - 11 GHz
v04.1007
MxN Spurious @ IF Port
mRF
0
1
0
xx
17.16
1
12.83
0
2
69.0
76.5
3
75.33
76.16
4
66.83 74.83
RF Freq. = 9.1 GHz @ -10 dBm
LO Freq. = 9.0 GHz @ +13 dBm
Measured as downconverter
nLO
2
26.0
39.83
57.83
78
77.33
3
9.0
53.0
76.83
61.66
78.16
4
37.33
33.66
71.0
78.16
79.66
HMC130
GaAs MMIC DOUBLE-BALANCED
MIXER, 6 - 11 GHz
Absolute Maximum Ratings
LO Drive
Storage Temperature
Operating Temperature
+27 dBm
-65 to +150 °C
-55 to +85 °C
%,%#42/34!4)#3%.3)4)6%$%6)#%
/"3%26%(!.$,).'02%#!54)/.3
4
Outline Drawing
Die Packaging Information [1]
Standard
Alternate
WP-3 (Waffle Pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. BOND PADS ARE .004” SQUARE
3. TYPICAL BOND PAD SPACING CENTER TO CENTER
.1 IS .006” EXCEPT AS SHOWN
4. DIE THICKNESS = .004” [.100 MM]
5. BACKSIDE METALIZATION: GOLD
6. BACKSIDE METAL IS GROUND
7. BOND PAD METALIZATION: GOLD
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
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