HMC493LP3_08 Datasheet, PDF (3/6 Pages) Hittite Microwave Corporation – SMT GaAs HBT MMIC DIVIDE-BY-4, DC - 18 GHz

v04.0507
HMC493LP3 / 493LP3E
SMT GaAs HBT MMIC
DIVIDE-BY-4, DC - 18 GHz
6
Output Voltage Waveform,
Pin= 0 dBm, Fout= 882 MHz, T= 25 °C
Absolute Maximum Ratings
500
300
100
-100
-300
-500
22.7
23.1
23.5
23.9
24.3
24.7
TIME (nS)
RF Input (Vcc = +5V)
Supply Voltage (Vcc1, Vcc2)
Channel Temperature (Tc)
Continuous Pdiss (T = 85 °C)
(derate 11.9 mW/° C above 85 °C)
Thermal Resistance (R )
TH
(junction to ground paddle)
Storage Temperature
Operating Temperature
ESD Sensitivity (HBM)
+13 dBm
+5.5V
135 °C
593 mW
84 °C/W
-65 to +150 °C
-40 to +85 °C
Class 1A
Typical Supply Current vs. Vcc
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Outline Drawing
Vcc1, Vcc2 (V)
Icc (mA)
4.75
84
5.0
96
5.25
108
Note: Divider will operate over full voltage range shown above
6 - 126
Package Information
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE
SOLDERED TO PCB RF GROUND.
7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED
LAND PATTERN.
Part Number
HMC493LP3
Package Body Material
Low Stress Injection Molded Plastic
Lead Finish
Sn/Pb Solder
HMC493LP3E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
MSL Rating
MSL1 ^[1]
MSL1 ^[2]
Package Marking ^[3]
493
XXXX
493
XXXX
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
Order On-line at www.hittite.com